VIA DDR333 Summit Highlights-II
Despite VIA’s strong endorsement of the DDR333 platform, DRAM manufacturers believe that the DDR333 architecture is only likely to assume mainstream status in 2003 at the earliest. The production ratio of DDR333 chips by year-end will only account for 6-7% of Nanya’s overall output, 5% of Micron's, 5% of Hynix’s, less than 5% of Elpida’s and over 10% of Samsung’s.
Low yield rates and much more expensive packaging are also factors holding back the DDR333 chip from emerging at an earlier time. At present, DRAM manufacturers still adopt the cheaper TSOP (tiny small outline package) process for DDR266 chip production. However, the DDR333 chips require the more expensive BGA (ball grid array) packaging process. VIA predicted that with chipset designers and DRAM makers continuingly launching related products, DDR chips are expected to take 50% of the DRAM market in the second half of 2002.
KingMax has displayed some information on their upcoming DDR400 memory module over at VIA DDR333 Summit. As VIA and SiS are clearing vying for DDR supremacy where we can see their DDR400 chipsets coming up in Q2 for both Intel and AMD platforms. DDR400 has a memory bandwidth of 3.2GB/s. However, we shall not see a remarkable improvement in performance since the FSB of the AMD processors still remain at 266Mhz and the upcoming P4 "Northwood" are at 533Mhz. The improvements will only be seen when DDR-II specs are being finalized and the actual DDR-II 400 memories with new features and technologies arrive or the FSB of AMD processors reach 166Mhz or Intel Pentium 4 processors reach 3Ghz and above.
Courtesy of vrzone